38th International Symposium for Testing and Failure Analysis
November 11-15, 2012
Phoenix Convention Center
Phoenix, Arizona USA
Expanding Failure Analysis: One Step Beyond
Electronic industries are conjoining multiple developments to offer smarter, greener, smaller, wireless, mobile, lower power, safe and counterfeit-free devices and systems
• Technology nodes are shrinking to nanoscale structures
• 3D integration is skyrocketing at the components and system level while integration of sensors and use of nanomaterials and organic electronics are expanding
This initiates incredible challenges for failure analysts facing the task of ultimate spatial resolution for more and more complex and heterogeneous devices
As failure analysts expand their science to face all these new and combined challenges, we go… one step beyond.
For more information about the 38th International Symposium for Testing and Failure Analysis please visit www.istfa.org.
Organizers would like to invite you to submit our work for publication and presentation at the ISTFA.
Abstract submission deadline is April 02, 2012. Visit www.istfa.org.
Click Here to register for this event.